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this is information on a product in full production. september 2012 doc id 022084 rev 1 1/12 12 esdascy automotive quad transil? array for esd protection datasheet ? production data features 4 unidirectional transil functions low leakage current: i r max. < 20 a at v rm 400 w peak pulse power (8/20 s) benefits high eos and esd protection levels high integration suitable for high density boards aec-q101 qualified complies with the following standards: iso 10605: c = 150 pf, r = 330 ? ? 30 kv (air discharge) ? 30 kv (contact discharge) iso 10605: c = 330 pf, r = 330 ? ? 30 kv (air discharge) ? 30 kv (contact discharge) iso 7637-2 ? pulse 1: v s = -100 v ? pulse 2a: v s = +50 v ? pulse 3a: v s = -150 v ? pulse 3b: v s = +100 v applications where esd and eos transient overvoltage protection in susceptible equipment is required, such as: information - entertainment signal communications connectivity comfort and convenience tm : transil is a trademark of stmicroelectronics. figure 1. esda14v2sc5y configuration figure 2. esda6v1sc6y and esda25sc6y configuration description the esdascy devices are monolithic voltage suppressors designed to protect components which are connected to data and transmission lines against esd. they clamp the voltage just above the logic level supply for positive transients, and to a diode drop below ground for negative transient. sot23-5l (sc-59) sot23-6l (sc-59) 1 2 3 5 4 1 2 3 6 5 4 www.st.com
characteristics esdascy 2/12 doc id 022084 rev 1 1 characteristics for a surge greater than the maximum va lues, the diode will fail in short-circuit. figure 3. electrical characteristics (definitions) table 1. absolute ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage iso10605 (c = 150 pf, r = 330 ? ) contact discharge air discharge iso10605 (c = 330 pf, r = 330 ? ) contact discharge air discharge 30 30 30 30 kv p pp peak pulse power (8/20s) ESDA5V3SC6Y, esda6v1sc6y 400 w esda14v2sc5y, esda25sc6y 300 i pp peak pulse current (8/20s) ESDA5V3SC6Y esda6v1sc6y esda14v2sc5y esda25sc6y 22 18 14 7 a t j operating junction temper ature range -40 to150 c t stg storage temperature range -65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = forward current i = peak pulse current i = breakdown current v = forward voltage drop r br rm rm rm pp r f v = clamping voltage cl f d = dynamic impedance t = voltage temperature
esdascy characteristics doc id 022084 rev 1 3/12 table 2. electrical characteristics - values (t amb = 25 c) order code v br @ i r i rm @ v rm v cl @ i pp (1) v f @ i f rd (2) ? tc line (3) min. max. max. typ. max. typ. max. typ. vvmaavvavmam ? 10 -4 /c pf ESDA5V3SC6Y 5.3 5.9 1 2 3 18 22 1.25 200 230 5 280 esda6v1sc6y 6.1 7.2 1 20 5.2 22 18 1.25 200 350 6 190 esda14v2sc5y 14.2 15.8 1 5 12 21 14 1.25 200 650 10 100 esda25sc6y 25 30 1 1 24 30 10 1.2 10 1000 10 60 1. 8/20 s waveform 2. square pulse, i pp = 15 a, t p = 2.5 s. 3. ? v br = ? t* (t amb - 25 c) * v br (25 c) figure 4. pulse power versus initial junction temperature figure 5. peak pulse power versus exponential pulse duration (typical values) 0 100 200 300 400 500 600 0 25 50 75 100 125 150 175 8/20s p pp (w) tj (c) p (w) pp 1 10 100 1000 10000 10 100 1000 t (s) p figure 6. clamping voltage versus peak pulse current (typical values, 8/20 s waveform) figure 7. leakage current versus junction temperature (typical values) i (a) pp 0,1 1 10 100 4 8 12 16 20 24 28 32 36 ESDA5V3SC6Y esda25scy esd14v2sc5y esda6v1sc6y 8/20s t j =25-c v (v) cl 0.01 0.1 1 10 100 1000 10000 25 50 75 100 125 150 ESDA5V3SC6Y (vr=3v) esda25scy (vr=24v) esd14v2sc5y (vr=12v) esda6v1sc6y (vr=5.2v) t (c) j i r (na)
characteristics esdascy 4/12 doc id 022084 rev 1 note: iso7637-2 pulse responses are not applicable for products with a breakdown voltage lower than the average battery voltage (13.5 v) like esda6v1sc6y. figure 8. iso7637-2 pulse 1 response (v s = -100 v) figure 9. iso7637-2 pulse 2a response (v s = 50 v) -10 15 10 5 0 -5 voltage (v) voltage esda25sc6y esda14v2sc5y esda25sc6y esda14v2sc5y -15 5 0 -5 -10 current current (a) time (ms) -0.5 0.0 0.5 1.0 1.5 2.0 2.5 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 0 50 40 30 20 10 voltage (v) voltage esda25sc6y esda14v2sc5y esda25sc6y esda14v2sc5y -4 12 8 4 0 current current (a) time (s) -20 0204060 80 100 16 time (s) -20 0204060 80 100
esdascy characteristics doc id 022084 rev 1 5/12 figure 10. iso7637-2 pulse 3a response (v s = -150 v) figure 11. iso7637-2 pulse 3b response (v s = 100 v) -10 15 10 5 0 -5 voltage (v) voltage esda25sc6y esda14v2sc5y esda25sc6y esda14v2sc5y -2 0.5 -0.5 -1 -1.5 current current (a) time (s) -0.5 0.0 0.5 1.0 1.5 2.0 20 time (s) -0.5 0.5 1.5 2.5 4.5 3.5 0 40 30 voltage (v) voltage esda25sc6y esda14v2sc5y esda25sc6y esda14v2sc5y current current (a) time (s) -0.2 0.8 1.8 50 time (s) 0 20 10 -0.2 0.8 1.8 1.2 0.8 1.6 -0.4 0.4 0
application and design guidelines esdascy 6/12 doc id 022084 rev 1 2 application and design guidelines more information is available in the stmicroelectronics application note an2689: ?protection of automotive electronics from el ectrical hazards, guidelines for design and component selection?. 3 ordering information figure 12. ordering information scheme esda xx scx y esd array breakdown voltage automotive grade 6v1 = 6.1 v 14v2 = 14.2 v 25 = 25 v package sc5 = sot23-5l sc6 = sot23-6l
esdascy package information doc id 022084 rev 1 7/12 4 package information epoxy meets ul94, v0 standard lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 13. sot23-5l footprint (dimensions in mm) table 3. sot23-5l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.45 0.035 0.057 a1 0 0.15 0 0.006 a2 0.90 1.30 0.035 0.051 b 0.30 0.50 0.012 0.020 c 0.09 0.20 0.004 0.008 d 2.80 3.05 0.11 0.118 e 1.50 1.75 0.059 0.069 e0.95 0.037 h 2.60 3.00 0.102 0.118 l 0.30 0.60 0.012 0.024 m 0 10 0 10 a2 a l h c b e d e e a1 0.95 0.60 1.20 1.10 3.50 2.30
package information esdascy 8/12 doc id 022084 rev 1 figure 14. sot23-6l footprint (dimensions in mm) table 4. sot23-6l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.45 0.035 0.057 a1 0 0.15 0 0.006 a2 0.90 1.30 0.035 0.051 b 0.30 0.50 0.012 0.020 c 0.09 0.20 0.004 0.008 d 2.80 3.05 0.11 0.118 e 1.50 1.75 0.059 0.069 e0.95 0.037 h 2.60 3.00 0.102 0.118 l 0.30 0.60 0.012 0.024 ? 0 10 0 10 a2 a l h c b e d e e a1 0.95 0.60 1.20 1.10 3.50 2.30
esdascy recommendation on pcb assembly doc id 022084 rev 1 9/12 figure 15. tape and reel specifications 5 recommendation on pcb assembly 5.1 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particles: powder particle size 20-45 m. 5.2 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 1.24 3.1 0.21 2.1 2.9
recommendation on pcb assembly esdascy 10/12 doc id 022084 rev 1 5.3 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 5.4 reflow profile figure 16. st ecopack? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
esdascy ordering information doc id 022084 rev 1 11/12 6 ordering information 7 revision history table 5. ordering information order codes marking (1) 1. the marking can be rotated by multiples of 90 to differentiate assembly location package weight base qty delivery mode ESDA5V3SC6Y es5y sot23-6l 16.7 mg 3000 tape and reel esda6v1sc6y es6y sot23-6l esda14v2sc5y ec1y sot23-5l esda25sc6y es2y sot23-6l table 6. document revision history date revision changes 04-sep-2012 1 first issue.
esdascy 12/12 doc id 022084 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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